An eco-friendly cleaning solution that contributes to product quality improvement by suppressing or eliminating issues that occur during the Wafer Blade Dicing process

Semiconductor, LED, etc. (Blade Dicing)

• Improved lubrication function : reduced friction during blade dicing → suppressed dust, chipping, and crack generation
• Low surface tension : Prevention of dust deposition on the wafer surface
• Corrosion prevention ability : Long-term dicing is possible with corrosion inhibition function
• Excellent cleaning power : Effective removal of fine dust generated on the surface
• Electric charge prevention function : Prevention of charge accumulation due to high conductivity (ESD effect)

Excellent cleaning performance

Corrosion reduction : Galvanic Cell Test Result

As a result of SEM (x1500) test, Hyper-Pro does not generate thermal damage and debris on the wafer surface

Electrostatic prevention

The lower the resistivity, the more frictional electricity generated during Wafer Saw is discharged to the outside to prevent static electricity. In the case of Hyper-Pro, the resistivity is very stable even when the dilution ratio is increased.