Synthesis of high-performance organic/inorganic materials

Synthesis of high-performance organic/inorganic materials is being researched to develop new products to secure competitiveness in the semiconductor/display business based on existing synthesis technologies. Based on various synthesis technologies, molecular design and additive application technologies, MTI develops and supplies various application products to meet customer requirements.

TBDB

Ultra-thin wafers are widely used in high-function devices, but they are very easily damaged, so the existing wafer handling method cannot be used as it is. Also, developing ultra-thin dedicated equipment requires enormous investment. Therefore, in order to use existing equipment as it is, use a wafer or glass as a carrier, complete all processes, separate it from the carrier, and perform the next process. In particular, the advanced packaging field is expected to be the only technological breakthrough as the technology that can improve semiconductor performance by reducing the minimum line width is reaching the physical limit of 30 nm – 20 nm.

Until now, TBDB(Temporary Bonding De-bonding) technology has been developed to handle wafers that are brittle and relatively thick, such as GaN and GaAs, for LED production but TBDB technology for ultra-thin wafers with a thickness of less than 50 μm will be required in the market in the future.