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Certificates

MTI ECO INNOVATION

Certificates

This is the
patent, registration, and certification details of MTI, Inc.

Patent Certificate

  • Cleaning solution for polymer removal and polymer removal method using the same
    Patent No. 10-0823714
  • Slurry composition for chemical mechanical polishing and chemical mechanical polishing method using the same
    Patent No. 10-1481573
  • Detergent composition for wafer dicing
    Patent No. 10-1828252
  • Coating composition for wafer protection in laser scribing process
    Patent No. 10-1764167
  • Protective coating composition for wafer processing and protective coating comprising the same
    Patent No. 10-1860549
  • Remover composition for wafer processing and release agent containing the same
    Patent No. 10-1893582
  • Protective coating composition for wafer processing, protective coating composition for wafer processing comprising the same and method for manufacturing the same
    Patent No. 10-1928831
  • Agent for removal of protective coating agent for wafer processing
    Patent No. 10-1928830
  • Agent for removal of protective coating agent for dicing process
    Patent No. 10-2038056
  • Protective coating agent for dicing process
    Patent No. 10-2094404
  • Backside adhesive tape for wafer level and its manufacturing method
    Patent No. 10-1936873
  • Tape for wafer processing
    Patent No. 10-2012905
  • Packaging EMI shield mounting adhesive tape and its manufacturing method
    Patent No. 10-1815150
  • Tape for wafer processing
    Invention : 699422
  • Detergent composition for wafer dicing
    Invention : 625387
  • Coating composition for wafer protection
    Invention : 625354
  • Protective coating composition for wafer processing and protective coating comprising the same
    Invention : 617633
  • Stripper composition for wafer processing and stripper containing the same
    Invention : 649381
  • Agent for removal of protective coating agent for dicing process
    Invention : 677543
  • Protective coating agent for dicing process
    Invention : 6862028
  • Protective coating composition for wafer processing and protective coating comprising the same
    Invention : 6862027
  • Agent for removal of protective coating agent for dicing process
    Invention : 6927619
  • Protective organic-inorganic composite coating composition for wafer dicing and protective coating containing the same
    Invention : 10-2312935

Trademark Registration Certificate

  • HYPER-STAR
    Registration No. 40-1019091
  • HYPER-PRO
    Registration No. 40-1019093
  • HYPER-MAX
    Registration No. 40-1023474
  • HYPER-BLUE
    Registration No. 40-1369634
  • MAC-RM
    Registration No. 40-1329898
  • MAC-SP
    Registration No. 40-1329896
  • SD18F
    Registration No. 40-1090562
  • SD18S
    Registration No. 40-1090568
  • Service mark registration certificate
    Registration No. 41-0280771

Other certificates

  • Material and parts specialized company confirmation
  • ISO 9001:2015 Quality Management System
    Certification No. GKC-0387-QC
  • ISO 14001:2015 Environmental Management System
    Certification No. GKC-0387-EC
  • ASE KOREA Awards
  • Strong Small Business 100+ Certificate
  • Excellent technology evaluation company certificate
    Certification No. NICE-2022-77-002838
  • Certificate of Management Innovation Small and Medium Business (Main-Biz)
    Certification No. R190601-02729
  • Innovative Small and Medium Business (Inno-Biz) Certificate
    Certification No. R160601-00055
  • Company affiliated research institute certificate
    Certification No. 2013113398
  • Venture business confirmation certificate
    Certification No. 20210102051
  • Excellent Credit Rating Company Certificate
    Certification No. GCS-2022-00103
  • Country of origin certified exporter certificate for each company
    Certification No. 020-19-100007
  • Excellent job company certificate
    Certification No. 2021-30