Process chemical that removes PR residue with excellent PR removal rate and excellent wetting ability between PR processes

FAB, Bumping, etc

• Rapid solubility : PR Residue does not occur due to rapid solubility in various temperatures
• Prevention of metal corrosion : Cu, Al, Ti, etc. corrosion prevention (Cu Etch Rate = 1.0 Å/min (60℃*30 min)
• Excellent versatility : Applicable to PR Thickness Bump or RDL materials within 10~100um
• Equipment application ability : All kinds of equipment such as Spray Tools & Bath System can be applied
• Both DFR and Liquid PR can be applied (dissolution/exfoliation type can be removed)

Application Test