An innovative, high-functional coating solution that contributes to yield and quality improvement during the die process by fundamentally protecting the surface of sensitive materials such as CMOS image sensors from issues such as particles, chipping, cracks, scratches, etc.

Semiconductor, LED, Display, etc. (Surface protection of sensitive materials)

• Forms a protective film without damaging the wafer material
• Uniform coating by low surface tension
• Polymer coating using short-time (within 5 minutes) thermal polymerization
• Bond Pad Material Corrosion Prevention
• Molecular design for easy peeling without residue
• Formulation to prevent adhesion of foreign substances generated during the dicing process
• After curing, the surface quality changes to hydrophobic, making it suitable for processes where water is used

Prevention of Particle & Scratch

Protection of the wafer surface from particles and scratches by forming a protective coating layer

Prevention of collet damage during D/T process

High hardness (4H) of the coating layer prevents surface damage caused by collet pressure