Cleaning solution to effectively remove the coating layer at a desired point after applying MAC-SP

Semiconductor, LED, Display, etc. (Surface protection of sensitive materials)

• Remove the coating layer without any residue on the surface of the device
• Remove other particles including coating layer through excellent wetting and rinse ability
• Easy to treat wastewater by maintaining water solubility in the state where the coating layer is dissolved
• Prevent re-contamination on the surface of device as a complete soluble type of product
• No damage with device

Complete and Effective Cleaner for MAC-SP

After MAC-SP coating, C element, the main component of MAC-SP, increases on the surface of the material.

Component measurement results after applying MAC-RM, the same elemental component and content ratio as the substrate before material surface coating → complete peeling without formation of coating residues and other by-products