-
Company Introduction
-
Business Field
-
Product Introduction
-
Recruitment
-
Community
Film&Tape
MTI ECO INNOVATION
Film&Tape
UV Dicing Tape
UV Dicing Tape
A dicing tape for wafer fixing that has high adhesive strength during the dicing process and reduced adhesive strength after UV curing, making it easy to pick up and peel off.
Description
- Wafer is fixed with high adhesion in the Dicing process, and adhesion decreases after UV irradiation, making it easy to peel off
- After UV irradiation, the surface of the adhesive can be peeled off without contamination
Applications
- LED Package, Wafer Dicing / Semiconductor Package, Wafer Dicing
Properties
- Strong adhesion and prevention of chipping and chip flying
- After UV irradiation, the adhesive strength is lowered, so it is easily peeled off during Die Pick Up
- No contamination or damage on the product surface after UV irradiation
- Semiconductor / LED Package & Wafer
- Lineup of products suitable for various adherends
Product
Structure
-
mti@mtisemi.com
-
031-493-6737
-
154-23 Wonsi-ro, Danwon-gu,
Ansan-si, Gyeonggi-do
(729 Wonsi-dong)