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Film&Tape
MTI ECO INNOVATION
Film&Tape
Non UV Dicing Tape
Non UV Dicing Tape
A dicing tape for wafer fixing that has high adhesive strength during the dicing process and reduced adhesive strength after UV curing, making it easy to pick up and peel off.
Description
- Wafer fixation without pushing in the dicing process, easy peeling after dicing
- Possible to peel without contamination on the wafer surface
Applications
- LED Package, Wafer Dicing / Semiconductor Package, Wafer Dicing
Properties
- Prevention of Chipping and Chip Flying with Low Adhesion
- Easy peeling during Die Pick Up due to low adhesion
- No contamination or damage to product surface
- Semiconductor / LED Package & Wafer
- Product lineup suitable for various adherends
- Possession of expandable type products by function
Product
Structure
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mti@mtisemi.com
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031-493-6737
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154-23 Wonsi-ro, Danwon-gu,
Ansan-si, Gyeonggi-do
(729 Wonsi-dong)