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Film&Tape
MTI ECO INNOVATION
Film&Tape
Backside Coating Protection Tape
Backside Coating Protection Tape
Thermally curable adhesive tape that enables laser marking at the wafer level, can withstand the dicing process, and ultimately protects the exposed backside of the chip.
Description
- Uniform Thickness & Reworkable
- Wafer protection during dicing
- Laser marking able surface
Applications
- WLCSP, PLP
Properties
- Attached to the wafer backside, laser marking is possible, and chipping in the dicing saw process, protection of the exposed back side without side cracks
- Rework possible before Post Cure
- Securing Laser Marking Visibility and IR Transmittance
- Thin wafer reinforcement role during the dicing process
- Product thickness / No delamination during reflow process
- Reliability verification completed: MSL Level 1, HTS, TCT, u Hast
Product
Structure
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mti@mtisemi.com
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031-493-6737
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154-23 Wonsi-ro, Danwon-gu,
Ansan-si, Gyeonggi-do
(729 Wonsi-dong)