film_tape 1 페이지 | 주식회사 MTI

film_tape 1 페이지 | 주식회사 MTI

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Film&Tape

MTI ECO INNOVATION

Film&Tape

TOTAL 7

TBDB Tape (Development)

MTI Temporary Bonding De-bonding Solution Applied Tape for State-of-the-art Semiconductor Packaging

7
Mold Release Film

Keeping the mold clean from materials such as silicone or epoxy, excellent release performance with no resin in the cavity Applicable in matte type for semiconductor packing or glossy type for LED manufacturing.

6
Backside Coating Protection Tape

Thermally curable adhesive tape that enables laser marking at the wafer level, can withstand the dicing process, and ultimately protects the exposed backside of the chip.

5
Non UV Dicing Tape

A dicing tape for wafer fixing that has high adhesive strength during the dicing process and reduced adhesive strength after UV curing, making it easy to pick up and peel off.

4
UV Dicing Tape

A dicing tape for wafer fixing that has high adhesive strength during the dicing process and reduced adhesive strength after UV curing, making it easy to pick up and peel off.

3
BG Tape

This tape is intended to protect the pattern side & bump side of the wafer in the process of grinding the back side of the wafer to the wafer thickness desired by the user. We have UV PSA and Non PSA Line up by adhesive type.

2
PKG EMI Sputter Tape

High-functional adhesive tape that can withstand the process for shielding electromagnetic waves by sputter or spray method at the package level

1

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